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机译:金属间化合物的间隔可靠性和电阻率缩放为先进的互连材料
Department of Materials Science Tohoku University Sendai 980-8579 Japan;
Department of Materials Science and Engineering Rensselaer Polytechnic Institute Troy New York 12180 USA;
Department of Materials Science Tohoku University Sendai 980-8579 Japan;
Department of Materials Science Tohoku University Sendai 980-8579 Japan;
Department of Materials Science Tohoku University Sendai 980-8579 Japan;
Department of Materials Science and Engineering Rensselaer Polytechnic Institute Troy New York 12180 USA;
Department of Materials Science and Engineering Rensselaer Polytechnic Institute Troy New York 12180 USA;
Department of Materials Science Tohoku University Sendai 980-8579 Japan;
机译:固液互扩散Cu / Sn微凸点互连中孔的形成降解Cu_6Sn_5金属间化合物
机译:高级互连:材料,工艺和可靠性
机译:缩小尺寸的基于铜的互连件的电阻率和可靠性之间的权衡特性
机译:用于3D IC应用的Cu / Sn互连中Cu_6Sn_5金属间化合物和多层结构的机械可靠性评估
机译:First-fevel Interconnects in Electronics Packaging: Alloyed Silver Intermetallic Growth Kinetics and Their Mechanical Reliability Effects on Wire Bonding =电子封装中的第一级互连:合金银互联金属生长动力学 和他们的机械可靠性 对线束的影响
机译:Al-50Vol中的Al / Cu接口在Al / Cu接口中的间隔和金属间化合物。通过固态烧结制备的%Cu复合材料
机译:对有关“确定Cu6Sn5和Cu3Sn金属间化合物的互扩散系数的数值方法”的评论的回应
机译:新型金属间化合物的合成和表征,题为:先进磁性材料的激光加工