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The fabrication of Schottky photodiode by monolayer graphene direct-transfer-on-silicon

机译:单层石墨烯直接转移硅的肖特基光电二极管的制造

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摘要

A two-step hot embossing process was used to transfer graphene and to fabricate Gr/Si Schottky photodiodes. As a direct graphene transfer technique through a hot embossing system, chemical vapor deposition Gr monolayer was transferred from copper foil to cyclic olefin copol-ymer foil without a poly(methylmethacrylate) sacrificial layer. Then, hot embossing was employed once again to bond graphene with the prepared Si substrate to form Schottky contact. Electrical and photoelectrical characterizations have been performed to evaluate the Schottky photodiode. The photocurrent increases linearly with light intensity under 633 nm illumination. With an appropriate bias voltage, the maximum responsivity reaches 0.73 A/W. Extracted from I-V characteristics by Cheung's function, the Schottky barrier height and ideality factor are 1.01 eV and 2.66, respectively. The experimental result shows the feasibility and effectiveness of this hot embossing fabrication process, which demonstrates the opportunity for large scale production and provides a new approach for graphene optoelectronics.
机译:两步热压花工艺用于转移石墨烯并制造GR / SI肖特基光电二极管。作为通过热压花系统的直接石墨烯转移技术,化学气相沉积GR单层从铜箔转移到没有聚(甲基丙烯酸甲酯)牺牲层的环状烯烃共同箔。然后,再次使用热压花,再次用制备的Si衬底键合石墨烯,形成肖特基触点。已经进行了电气和光电表征以评估肖特基光电二极管。光电流随着633nm照明的光强度线性增加。具有适当的偏置电压,最大响应率达到0.73 A / W.由Cheung的功能从I-V特性提取,肖特基势垒高度和理想因子分别为1.01eV和2.66。实验结果表明了这种热压花制造过程的可行性和有效性,这表明了大规模生产的机会,并为石墨烯光电子提供了新的方法。

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  • 来源
    《Journal of Applied Physics》 |2020年第1期|014501.1-014501.6|共6页
  • 作者单位

    State Key Laboratory for Manufacturing System Engineering Xi'an Jiaotong University Xi'an Shaanxi 710049 China Chilab-Materials and Microsystems Laboratory DISAT Politecnico di Torino-Via Lungo Piazza d'Armi 6 IT 10034 Chivasso (Turin) Italy;

    State Key Laboratory for Manufacturing System Engineering Xi'an Jiaotong University Xi'an Shaanxi 710049 China;

    Chilab-Materials and Microsystems Laboratory DISAT Politecnico di Torino-Via Lungo Piazza d'Armi 6 IT 10034 Chivasso (Turin) Italy;

    Chilab-Materials and Microsystems Laboratory DISAT Politecnico di Torino-Via Lungo Piazza d'Armi 6 IT 10034 Chivasso (Turin) Italy Center for Sustainable Future Technologies Italian Institute of Technology Corso Trento 21 IT 10129 Turin Italy;

    Chilab-Materials and Microsystems Laboratory DISAT Politecnico di Torino-Via Lungo Piazza d'Armi 6 IT 10034 Chivasso (Turin) Italy;

    Chilab-Materials and Microsystems Laboratory DISAT Politecnico di Torino-Via Lungo Piazza d'Armi 6 IT 10034 Chivasso (Turin) Italy CNR-IMEM Parco Area delle Scienze 37a IT 43124 Parma Italy;

    Chilab-Materials and Microsystems Laboratory DISAT Politecnico di Torino-Via Lungo Piazza d'Armi 6 IT 10034 Chivasso (Turin) Italy Center for Sustainable Future Technologies Italian Institute of Technology Corso Trento 21 IT 10129 Turin Italy;

    Chilab-Materials and Microsystems Laboratory DISAT Politecnico di Torino-Via Lungo Piazza d'Armi 6 IT 10034 Chivasso (Turin) Italy CNR-IMEM Parco Area delle Scienze 37a IT 43124 Parma Italy;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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