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Geometric structure and electronic properties of wurtzite GaN/HfO_2 interface: A first-principles study

机译:纤锌矿型GaN / HfO_2界面的几何结构和电子性质:第一性原理研究

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摘要

III-V interface with high-k oxide, especially HfO2, is crucial to the development of high mobility microelectronic devices. In this work, we systematically investigated the wurtzite GaN/cubic HfO2 interface based on the first-principles calculations with density functional theory in terms of the geometric structure and electronic properties. In order to mimic the high-k growth conditions, the interfacial oxygen contents in the slab interface models varied to study the interface stability and the relevant electronic structures. It is found that the oxygen rich interface, i.e., oxygen content of 83.3% (O5), shows the most stability in a large range of the oxygen chemical potential from 0 eV to -4.34 eV. Through the calculations of local density of states and Bader charge analysis, we noticed that increasing the interfacial oxygen content leads to the increase of the valence band offset (VBO) and the decrease of the conduction band offset (CBO), respectively. More importantly, interface O5 displays a promising VBO (0.86 eV) and CBO (1.34 eV), which meets the industrial requirements to confine the carrier in the III-V channel materials. Furthermore, no interfacial gap states are observed in interface 05, indicating that 05 is free of Fermi level pinning This theoretical exploration suggests that varying oxygen content at the interface could result in the optimal interface for the applications of high mobility electronic devices. Published by AIP Publishing.
机译:具有高k氧化物(尤其是HfO2)的III-V界面对于高迁移率微电子器件的开发至关重要。在这项工作中,我们基于第一性原理和密度泛函理论,从几何结构和电子特性的角度,系统地研究了纤锌矿型GaN /立方HfO2界面。为了模拟高k生长条件,改变平板界面模型中的界面氧含量以研究界面稳定性和相关的电子结构。发现富氧界面,即氧含量为83.3%(O 5),在从0eV到-4.34eV的大范围的氧化学势中显示出最稳定的。通过计算局部态密度和Bader电荷分析,我们注意到增加界面含氧量分别导致价带偏移(VBO)的增加和导带偏移(CBO)的减少。更重要的是,接口O5显示出有希望的VBO(0.86 eV)和CBO(1.34 eV),满足了将载流子限制在III-V沟道材料中的工业要求。此外,在界面05上未观察到界面间隙状态,表明05不含费米能级钉扎。此理论探索表明,界面处的氧含量变化可能会为高迁移率电子设备的应用提供最佳界面。由AIP Publishing发布。

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  • 来源
    《Journal of Applied Physics》 |2018年第24期|245703.1-245703.6|共6页
  • 作者单位

    Henan Agr Univ, Coll Sci, Zhengzhou 450002, Henan, Peoples R China;

    Nankai Univ, Dept Elect, Tianjin 300071, Peoples R China;

    Nankai Univ, Tianjin Key Lab Photoelect Thin Film Device & Tec, Tianjin 300071, Peoples R China;

    Henan Univ Technol, Coll Sci, Zhengzhou 450001, Henan, Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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