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首页> 外文期刊>Journal of Applied Physics >Electrical properties of multiple-layer structures formed by implantation of nitrogen or oxygen and annealed under high pressure
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Electrical properties of multiple-layer structures formed by implantation of nitrogen or oxygen and annealed under high pressure

机译:通过注入氮或氧形成并在高压下退火的多层结构的电性能

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摘要

Silicon-on-insulator-like structures formed in either oxygen- or nitrogen-implanted silicon during anneals under atmospheric and enhanced hydrostatic pressure are characterized by means of electrical techniques (current-voltage and capacitance-voltage measurements). It was found that the application of high pressure (~1 GPa) stimulates the formation of a perfect top silicon layer and results in the degradation of the properties of the buried insulator. The latter effect is caused by defect accumulation in the buried insulator and leads to a decrease in the effective thickness of the insulator layer as extracted from capacitance-voltage measurements. Pressure-stimulated formation of electrically active centers (donors and acceptors) in the top silicon layer and substrate was found. The fixed charge in the oxide was found to be independent on the pressure applied during anneals, whereas the negative charge in the nitride increased with pressure.
机译:通过电技术(电流-电压和电容-电压测量)来表征在大气压和增强的静水压力下退火期间在注入氧或氮的硅中形成的绝缘体上硅样结构。结果发现,施加高压(〜1 GPa)可促进形成完美的顶层硅层,并导致埋入式绝缘子的性能下降。后一种效应是由埋在绝缘体中的缺陷积累引起的,并导致绝缘体层的有效厚度减小,如从电容电压测量中提取的那样。发现在顶部硅层和衬底中压力激发的电活性中心(施主和受主)的形成。发现氧化物中的固定电荷与退火期间施加的压力无关,而氮化物中的负电荷随压力增加。

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