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Comparative structural and electrical analysis of NiO and Ti doped NiO as materials for resistance random access memory

机译:NiO和Ti掺杂NiO作为电阻随机存取存储器材料的比较结构和电学分析

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摘要

In order to investigate the mechanism behind bistable resistance switching in NiO thin films, we have done detailed x-ray photon spectroscopy (XPS) and x-ray diffraction Analysis (XRD) on NiO and Ti doped NiO samples fabricated under various conditions. We discovered that a high initial resistivity was required for samples to undergo bistable resistance switching, and the presence of metallic Ni content in these samples was determined by XPS. XRD data also showed that NiO grown with a relative (200) orientation was preferred over those grown with relative (111) orientation.
机译:为了研究NiO薄膜中双稳态电阻转换的机理,我们对在各种条件下制备的NiO和Ti掺杂的NiO样品进行了详细的X射线光子能谱(XPS)和X射线衍射分析(XRD)。我们发现对样品进行双稳态电阻切换需要很高的初始电阻率,并且通过XPS确定了这些样品中金属Ni的存在。 XRD数据还显示,以相对(200)取向生长的NiO优于以相对(111)取向生长的NiO。

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