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首页> 外文期刊>Journal of Applied Physics >Mechanically stiffened and thermally softened bulk modulus of BaXO_3(X=Ti,Zr,Nb) cubic perovskites
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Mechanically stiffened and thermally softened bulk modulus of BaXO_3(X=Ti,Zr,Nb) cubic perovskites

机译:机械增强和热软化BaXO_3(X = Ti,Zr,Nb)立方钙钛矿的体积模量

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摘要

Although the physics behind the bulk modulus, B{T,P), as a function of temperature (T) and pressure (P), has been intensively investigated, an atomic scale understanding of this attribute remains a high challenge. Here, we show that the B{T,P) for BaXO_3 (X=Ti,Zr,Nb) can be established by connecting the B directly to the bond length and bond energy and their response to the applied T and P in the form of binding energy density, B[E/d~3(T,P)]. Besides an estimation of the Debye temperature and single bond energy, outcomes clarified that the thermally softened B arises from bond expansion and bond weakening due to lattice vibration and the mechanically stiffened B results from bond compression and bond strengthening due to mechanical work hardening.
机译:尽管已经深入研究了体积模量B {T,P)作为温度(T)和压力(P)的函数的物理原理,但是对于此属性的原子尺度理解仍然是一个挑战。在这里,我们表明BaXO_3(X = Ti,Zr,Nb)的B {T,P)可以通过将B直接连接到键长和键能及其对施加的T和P的响应形式建立结合能密度B [E / d〜3(T,P)]。除了估算德拜温度和单键能以外,结果还表明,热软化的B是由于晶格振动引起的键膨胀和键减弱而引起的,而机械硬化的B是由于机械加工硬化而引起的键压缩和键的增强引起的。

著录项

  • 来源
    《Journal of Applied Physics》 |2011年第3期|p.184-187|共4页
  • 作者单位

    Department of Physics, Engineering Research Center for Nanophotonics and Advanced Instrument,Ministry of Education, East China Normal University, Shanghai 200062, People's Republic of China;

    Department of Physics, Engineering Research Center for Nanophotonics and Advanced Instrument,Ministry of Education, East China Normal University, Shanghai 200062, People's Republic of China;

    Department of Physics, Engineering Research Center for Nanophotonics and Advanced Instrument,Ministry of Education, East China Normal University, Shanghai 200062, People's Republic of China;

    Department of Materials Science and Engineering, State Key Laboratory of New Ceramic and FineProcessing, Tsinghua University, Beijing 100084, People's Republic of China;

    Department of Materials Science and Engineering, State Key Laboratory of New Ceramic and FineProcessing, Tsinghua University, Beijing 100084, People's Republic of China;

    Department of Materials Science and Engineering, State Key Laboratory of New Ceramic and FineProcessing, Tsinghua University, Beijing 100084, People's Republic of China;

    School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue,Singapore 639798 and Singapore Institute for Quantum Engineering and Micro-Nano Energy Technology and Key Laboratory of Low-Dimensional Materials and Application Technologies,Faculty of Physics, Xiangtan University, Hunan 411105, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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