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首页> 外文期刊>Journal of Applied Physics >Focused ion beam and electron microscopy characterization of nanosharp tips and microbumps on silicon and metal thin films formed via localized single-pulse laser irradiation
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Focused ion beam and electron microscopy characterization of nanosharp tips and microbumps on silicon and metal thin films formed via localized single-pulse laser irradiation

机译:通过局部单脉冲激光辐照形成的硅和金属薄膜上的纳米尖锐尖端和微凸点的聚焦离子束和电子显微镜表征

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摘要

Cross-sections of laser fabricated nanosharp tips and microbumps on silicon and metal thin films are produced and examined in this work. These structures are formed with a Q-switched neodymium doped yttrium aluminum garnet nanosecond-pulse laser, emitting at its fourth harmonic of 266 nm, using a mask projection technique to generate circular laser spots, several microns in diameter.' Cross-section of selected structures were produced using a focused ion beam and were characterized via electron microscopy. The diffraction patterns of the silicon samples indicate that the laser formed tip maintains the same single crystal structure as the original silicon film. Examinations of the laser formed structures in metal films confirm that the microbumps are hollow, while revealing that the vertical protrusions are solid.
机译:在这项工作中,产生并检验了在硅和金属薄膜上激光制造的纳米锐利尖端和微型凸块的横截面。这些结构是由Q开关掺钕钇铝石榴石纳秒脉冲激光器形成的,并通过掩模投影技术产生其266 nm的四次谐波,以产生直径为几微米的圆形激光点。使用聚焦离子束产生选定结构的横截面,并通过电子显微镜表征。硅样品的衍射图表明,激光形成的尖端保持与原始硅膜相同的单晶结构。对金属膜中激光形成的结构的检查确认了微凸点是空心的,同时揭示了垂直突起是实心的。

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  • 来源
    《Journal of Applied Physics》 |2011年第1期|p.014304.1-014304.5|共5页
  • 作者单位

    Department of Electrical Engineering, Lake Superior State University, Sault Ste. Marie,Michigan 49783, USA,Department of Electrical Engineering and Computer Science, University of Toledo, Toledo,Ohio 43606, USA;

    Department of Electrical Engineering and Computer Science, University of Toledo, Toledo,Ohio 43606, USA;

    Department of Bioengineering, University of Toledo, Toledo, Ohio 43606, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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