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机译:使用SF_6 / O_2电感耦合等离子体对硅进行50 nm以下深冷蚀刻的轮廓模拟模型
Department of Micro- and Nanoelectronic Systems, Institute of Micro and Nanoelectronics, Faculty of Electrical Engineering and Information Technology, Ilmenau University of Technology, Gustav-Kirchhoff-Strasse 1, Ilmenau 98693, Germany,Molecular Foundry, Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley, California 94720, USA;
Molecular Foundry, Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley, California 94720, USA;
Molecular Foundry, Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley, California 94720, USA,Oxford Instruments, 300 Baker Avenue, Suite 150, Concord, Massachusetts 01742, USA;
Department of Micro- and Nanoelectronic Systems, Institute of Micro and Nanoelectronics, Faculty of Electrical Engineering and Information Technology, Ilmenau University of Technology, Gustav-Kirchhoff-Strasse 1, Ilmenau 98693, Germany;
机译:模拟用于硅蚀刻的Cl_2 / O_2 / Ar电感耦合等离子体:SiO_2腔室壁涂层的影响
机译:SF6电感耦合等离子体的硅低温蚀刻:组合建模和实验研究
机译:使用SF_6 / Ar / O_2混合气体通过电感耦合等离子体刻蚀定义的铂薄膜微图案
机译:电感耦合等离子体反应离子刻蚀系统中基于SF_6 / C_4F_8 / Ar / O_2的化学物质对石英的高速各向异性刻蚀
机译:感应耦合等离子体中的硅,二氧化硅和铌酸锂的侧壁轮廓和蚀刻机制。
机译:硅晶片蚀刻速率特性具有突发宽度使用150 kHz带高功率突发电感耦合等离子体
机译:考虑电荷效应和低温条件的硅等离子体刻蚀轮廓模拟