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Charge neutral MoS_2 field effect transistors through oxygen plasma treatment

机译:通过氧等离子体处理为中性MoS_2场效应晶体管充电

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摘要

Lithographically fabricated MoS_2 field effect transistors suffer from several critical imperfections, including low sub-threshold swings, large turn-on gate voltages (V_T), and wide device-to-device variability. The large magnitude and variability of V_T stems from unclean interfaces, trapped charges in the underlying substrate, and sulfur vacancies created during the mechanical exfoliation process. In this study, we demonstrate a simple and reliable oxygen plasma treatment, which mitigates the effects of unintentional doping created by surface defect sites, such as S vacancies, and surface contamination. This plasma treatment restores charge neutrality to the M0S2 and shifts the threshold turn-on voltage towards 0 V. Out of the 10 devices measured, all exhibit a shift of the FET turn-on voltage from an average of -18 V to -2 V. The oxygen plasma treatment passivates these defects, which reduces surface scattering, causing increased mobility and improved sub-threshold swing. For as-prepared devices with low mobilities (~0.01 cm~2/V s), we observe up to a 190-fold increase in mobility after exposure to the oxygen plasma. Perhaps the most important aspect of this oxygen plasma treatment is that it reduces the device-to-device variability, which is a crucial factor in realizing any practical application of these devices.
机译:光刻制造的MoS_2场效应晶体管具有几个关键缺陷,包括低亚阈值摆幅,大导通栅极电压(V_T)和广泛的器件间差异性。 V_T的大幅度和可变性是由于界面不干净,下面的基底中捕获的电荷以及机械剥离过程中产生的硫空位所致。在这项研究中,我们证明了一种简单而可靠的氧等离子体处理,可减轻表面缺陷部位(例如S空位和表面污染)造成的意外掺杂的影响。这种等离子体处理可将电荷恢复到M0S2的中性状态,并将阈值导通电压移至0V。在所测量的10个器件中,所有器件均显示出FET导通电压从平均-18 V移至-2 V氧等离子体处理钝化了这些缺陷,从而减少了表面散射,从而增加了迁移率并改善了亚阈值摆幅。对于低迁移率(〜0.01 cm〜2 / V s)的准备好的设备,我们观察到暴露于氧等离子体后迁移率最多可提高190倍。氧等离子体处理的最重要方面可能是减少了设备之间的差异,这是实现这些设备的任何实际应用的关键因素。

著录项

  • 来源
    《Journal of Applied Physics》 |2016年第19期|195702.1-195702.6|共6页
  • 作者单位

    Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, California 90089, USA;

    Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, California 90089, USA;

    XEI Scientific, Redwood City, California 94063, USA;

    Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, California 90089, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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