Interaction of shear-coupled grain boundary motion with crack: Crack healing, grain boundary decohesion, and sub-grain formation

摘要

Stress-driven grain boundary motion is one of the main mechanisms responsible for microstructural evolution in polycrystalline metals during deformation. In this research, the interaction of shear-coupled grain boundary motion (SCGBM) in face-centered cubic metals with crack, which is a common type of structural defects in engineering materials, has been studied by using molecular dynamics simulations in simple bicrystal models. The influences of different parameters such as metal type, temperature, grain boundary structure, and crack geometry have been examined systematically. Three types of microstructural evolution have been identified under different circumstances, namely, crack healing, grain boundary decohesion, and sub-grain formation. The underlying atomistic mechanisms for each type of SCGBM-crack interaction, particularly grain boundary decohesion and crack healing, have also been examined. It is found that crack healing is generally favoured during the SCGBM-crack interaction at relatively high temperature in metals with relatively low stacking fault energy and grain boundary structure with relatively low misorientation angles. The results of this work may open up new opportunities for healing severely damaged materials.