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首页> 外文期刊>Journal of Applied Electrochemistry >Electrodeposition of silver–tin alloys from pyrophosphate-cyanide electrolytes
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Electrodeposition of silver–tin alloys from pyrophosphate-cyanide electrolytes

机译:焦磷酸盐-氰化物电解质对银锡合金的电沉积

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Using cyclic-voltammetric techniques, a pyrophosphate-cyanide electrolyte for the electrodeposition of compact Ag–Sn alloy coatings is investigated. This electrolyte is suited to further investigations on the alloy composition, structure and properties. The electrodeposition of coatings with up to 40 wt% Sn is possible from the investigated complex electrolytes. The alloy surpasses the saturation limit of the silver lattice with Sn and allows the formation of coatings with phase heterogeneity. At high tin content an ordered spatial distribution of different alloy phases on the cathodic surface can be observed. The pattern formation in this system looks very similar to the phenomena and structures observed during electrodeposition of other silver alloys, such as Ag–Sb, Ag–Bi and Ag–In.
机译:使用循环伏安技术,研究了用于电沉积致密Ag-Sn合金涂层的焦磷酸盐-氰化物电解质。该电解质适合于进一步研究合金成分,组织和性能。从研究的复合电解质中可以电沉积最多40%(重量)的Sn涂层。该合金用Sn超过了银晶格的饱和极限,并允许形成具有相异质性的涂层。在高锡含量下,可以观察到阴极表面上不同合金相的有序空间分布。该系统中的图案形成看起来非常类似于在电沉积其他银合金(例如Ag-Sb,Ag-Bi和Ag-In)时观察到的现象和结构。

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