Preparation of Nickel Ferrite-Copper Composite by Pressureless Infiltration

摘要

Pressureless infiltration was used to prepare a dense Cu/NiFe_2O_4-10NiO composite with interlocking microstructure. The results showed that the addition of Cu_2O in Cu could improve the wettability between Cu and NiFe_2O_4. The metallic phase content and densification of the resulting composite were 34 wt% and 99.2%, respectively. The resulting composite had a flexural strength of 200 ± 20 MPa, a room-temperature thermal diffusivity of 0.12 cm~2/s, and an electrical conductivity of 1503 S/cm at 900℃.