Hydrophilic direct bonding and debonding of ultrathin glass substrates for high-temperature devices

摘要

The direct hydrophilic bonding and debonding of ultrathin glass substrates onto and off from a glass carrier has been investigated, and a methodology is presented to reduce the excessive bonding strength after high-temperature annealing to facilitate the debonding process. It is found that with a preliminary surface conditioning of glasses at 300 degrees C and 400 degrees C in vacuum at 1 mbar before bonding, the specific surface energy of bonded wafers after high-temperature annealing for 30 min reduces to about 72% and 50% as compared to the control samples that have been surface-conditioned at room temperature instead.