首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers >Metal-Oxide-Nitride-Oxide-Semiconductor Memory Device with One-Side Halo Implantation to Enable Low-Voltage Operation Using Hot-Carrier Injection
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Metal-Oxide-Nitride-Oxide-Semiconductor Memory Device with One-Side Halo Implantation to Enable Low-Voltage Operation Using Hot-Carrier Injection

机译:单侧晕环注入的金属氧化物-氮化物-氧化物-半导体存储器件可通过热载流子注入实现低电压运行

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摘要

We have developed a metal-oxide-nitride-oxide-semiconductor (MONOS) memory device with one-side halo implantation, in which programming and erasing are performed by channel-hot-electron injection and hot-hole injection, respectively. This MONOS memory has a simple structure and is fabricated through the conventional complementary metal-oxide-semiconductor (CMOS) process before the specific process for the memory device. A threshold voltage shift of more than 3.0 V, obtained through a programming operation, results in a threshold voltage greater than the programming gate voltage and is sufficient to enable the 10-year lifetime of this device.
机译:我们已经开发了一种具有一侧晕注入的金属氧化物-氮化物-氧化物-半导体(MONOS)存储设备,其中分别通过沟道热电子注入和热空穴注入进行编程和擦除。该MONOS存储器具有简单的结构,并且在存储设备的特定过程之前通过常规的互补金属氧化物半导体(CMOS)过程制造。通过编程操作获得的大于3.0 V的阈值电压偏移会导致阈值电压大于编程栅极电压,并且足以使该器件的使用寿命达到10年。

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