Three-Dimensional Binocular Range Sensor Large Scale Integration with a 410 μs/Frame Output Time High-Speed Data Output Method

摘要

We developed a three-dimensional (3D) binocular range sensor LSI equipped with a high-speed data output circuit. The circuit outputs only the information of the position corresponding to the detected object. As a result, the output time was reduced and the frame rate improved. The chip was produced using a process of 0.35 μm complementary metal oxide semiconductor (CMOS) 1-poly 3-metal and has a die size of 4.20 × 3.33 mm~2. The chip uses a 3.0 V supply voltage and has a power consumption of 405 mW at a clock frequency of 10 MHz. The correlation of the image sensor's output takes 32 μs/frame and the maximum output time is 410 μs/frame. Because the output time is shorter enough than typical exposure, the frame rate is practically not limited by the data output time.