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Evaluation of crack closure stress by analyses of ultrasonic phased array images during global preheating and local cooling

机译:通过整体预热和局部冷却过程中的超声相控阵图像分析评估裂纹闭合应力

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摘要

Crack closure stress (CCS) is an important parameter that affects crack propagation rate. However, the method for measuring CCS in practical fields has yet to be developed. In this study, we propose a practical method of estimating CCS. In our experiment, a closed fatigue crack was imaged by a linear phased array (PA) method during crack opening by global preheating and local cooling (GPLC). Here, we assumed that the crack appears in PA images after the thermal stress induced by GPLC exceeds CCS. Therefore, we calculated the thermal stress induced by GPLC using an analytical solution and thereby estimated CCS. Then, to validate the CCS estimation method, we simulated the PA images by a finite difference time domain (FDTD) method with a damped double node (DON) model, where CCS was relieved by the calculated thermal stress. Consequently, the temporal variation in crack depth observed in the PA image was successfully reproduced in the simulation. Thus, the CCS estimation method was verified by comparing experimental results with analysis results.
机译:裂纹闭合应力(CCS)是影响裂纹扩展速率的重要参数。然而,在实际领域中用于测量CCS的方法尚未开发。在这项研究中,我们提出了一种估算CCS的实用方法。在我们的实验中,通过整体预热和局部冷却(GPLC)在裂纹开放期间通过线性相控阵(PA)方法对闭合疲劳裂纹进行了成像。在这里,我们假设在GPLC引起的热应力超过CCS之后,PA图像中出现了裂纹。因此,我们使用分析解决方案计算了GPLC引起的热应力,从而估算了CCS。然后,为了验证CCS估计方法,我们使用时域有限差分时域(FDTD)方法和阻尼双节点(DON)模型对PA图像进行了仿真,其中CCS被计算出的热应力缓解了。结果,在模拟中成功地再现了在PA图像中观察到的裂纹深度的时间变化。因此,通过将实验结果与分析结果进行比较,验证了CCS估计方法。

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  • 来源
    《Japanese journal of applied physics》 |2014年第7s期|07KC20.1-07KC20.7|共7页
  • 作者单位

    Department of Materials Processing, Tohoku University, Sendai 980-8579, Japan;

    Department of Materials Processing, Tohoku University, Sendai 980-8579, Japan;

    Department of Materials Processing, Tohoku University, Sendai 980-8579, Japan;

    Department of Materials Processing, Tohoku University, Sendai 980-8579, Japan;

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