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Mathematical Modeling of Solidification Microstructure of Pure Copper by Vacuum Continuous Casting and Its Experimental Verification

机译:真空连续铸造纯铜凝固组织的数学建模及实验验证

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The purpose of this study is to predict the solidification microstructure of pure copper rod by vacuum continuous casting (VCC) process and verify its accuracy by experimental observation. This study was extended from previous study (using 2D-CA model). A three dimensional cellular automaton (3D-CA) model and the finite difference method were utilized to simulate the macro-temperature field, nucleation, and grain growth of a pure copper rod based on the actual casting operations. The simulated solidification microstructures obtained from the 3D-CA model were found in good agreement with the results of actual casting experiments. Both numerical simulations and experimental observations show that the microstructure of a copper rod changes with casting speed and that the S/L interface moves closer to the orifice of the mould with increasing drawing speed.
机译:这项研究的目的是通过真空连续铸造(VCC)工艺预测纯铜棒的凝固组织,并通过实验观察验证其准确性。该研究是先前研究的扩展(使用2D-CA模型)。基于实际铸造操作,利用三维元胞自动机(3D-CA)模型和有限差分法来模拟纯铜棒的宏观温度场,成核和晶粒长大。发现从3D-CA模型获得的模拟凝固组织与实际铸造实验的结果非常吻合。数值模拟和实验观察均表明,铜棒的微观结构随铸造速度而变化,并且随着拉伸速度的增加,S / L界面更靠近模具的孔口。

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