NEW INTEGRATED SIMULATION TECHNIQUES FOR THE ELECTROMAGNETIC ANALYSIS OF MICROWAVE CIRCUITS USING THE TLM METHOD

摘要

A new methodology is presented which allows the integration of lumped elements into electromagnetic simulations, using the TLM method. It is shown that the new method retains the symmetrical condensed node algorithm structure, with the potential to be applied to all lumped elements. A new and accurate method for the extraction of circuit parameters from the impulse response of the TLM method is also presented. The method is simple and can be used for waveguide and planar structures. A study is carried out on the applications of various data windowing techniques during the postprocessing stages of an electromagnetic analysis. This has resulted in the realization of the need for careful selection of a particular window profile, according to the application and the nature of the required results.