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首页> 外文期刊>International Journal of Microwave and Wireless Technologies >Novel electromagnetic bandgap structure to mitigate simultaneous switching noise for mixed-signal system applications
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Novel electromagnetic bandgap structure to mitigate simultaneous switching noise for mixed-signal system applications

机译:新型电磁带隙结构可缓解混合信号系统应用中的同时开关噪声

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摘要

This paper proposes a novel T-shape electromagnetic bandgap (EBG) structure to suppress simultaneous switching noise (SSN) in mixed-signal systems. Noise is generated due to simultaneous switching multiple drivers in the digital ICs. It is called as SSN. It could propagate between power and ground planes of underlying PCB platform and interfere with the functionality of nearby RF/Analog ICs. So, the RF modules are isolated from the digital module for proper functioning of entire mixed-signal system. A high-impedance surface, called T-shape EBG has been implemented between digital and RF modules. It will exhibit the characteristics of bandgap for a wide frequency range to suppress the propagation of switching noise. A single unit-cell of T-EBG is periodically patterned over one side of the PCB and the other side is kept continuous. In this paper different characteristics of T-EBG have been simulated and verified with the measurement results. A 3 x 3 T-EBG layout provides an isolation of 240 dB from 0.72 to 6.39 GHz. A scaled version of T-EBG is used to shift the bandgap towards higher frequency range from 2.22 to 7.19 GHz. Also, a novel layout methodology has been proposed to broaden the bandgap from 2.02 to 18.84 GHz without reducing the thickness of dielectric substrate.
机译:本文提出了一种新颖的T形电磁带隙(EBG)结构,以抑制混合信号系统中的同时开关噪声(SSN)。由于同时切换数字IC中的多个驱动器而产生了噪声。它称为SSN。它可能会在底层PCB平台的电源和接地层之间传播,并干扰附近的RF /模拟IC的功能。因此,RF模块与数字模块隔离,以使整个混合信号系统正常工作。在数字模块和RF模块之间已实现了称为T形EBG的高阻抗表面。它会在很宽的频率范围内显示出带隙特性,从而抑制了开关噪声的传播。 T-EBG的单个单元电池在PCB的一侧定期进行构图,另一侧保持连续。本文对T-EBG的不同特性进行了仿真,并通过测量结果进行了验证。 3 x 3 T-EBG布局可在0.72至6.39 GHz范围内提供240 dB的隔离度。 T-EBG的缩放版本用于将带隙移向2.22至7.19 GHz的更高频率范围。而且,已经提出了一种新颖的布局方法,以将带隙从2.02扩大到18.84 GHz,而不减小介电衬底的厚度。

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