机译:转印模塑电力啜饮的铁氧体:包装中的挑战
Fraunhofer Institute for Reliability and Microintegration (IZM) Gustav Meyer Allee 25 13355 Berlin Germany;
Fraunhofer Institute for Reliability and Microintegration (IZM) Gustav Meyer Allee 25 13355 Berlin Germany;
Technical University Berlin Microperipheric Center Gustav Meyer Allee 25 13355 Berlin Germany;
Fraunhofer Institute for Reliability and Microintegration (IZM) Gustav Meyer Allee 25 13355 Berlin Germany;
Fraunhofer Institute for Reliability and Microintegration (IZM) Gustav Meyer Allee 25 13355 Berlin Germany;
Fraunhofer Institute for Reliability and Microintegration (IZM) Gustav Meyer Allee 25 13355 Berlin Germany;
Technical University Berlin Microperipheric Center Gustav Meyer Allee 25 13355 Berlin Germany;
Encapsulation of ferrite cores; transfer molding; core losses; molded power modules;
机译:封装电源(PSiP)和片上电源(PwrSoC)的技术路线图
机译:用于DC-DC转换器LSI封装的Zn铁氧体厚膜平面功率电感器的制造
机译:具有铁氧体环氧球芯的多匝键合线电感的建模,设计和表征,用于电源片上系统或封装系统应用
机译:用于电源SiP的铁氧体嵌入-封装视图
机译:电力电子应用中高频功率铁氧体器件的磁芯损耗表征和设计优化。
机译:静磁表面波在耗散铁氧体-MTMs-金属结构处的传播
机译:LSI封装电源有机插入中填充Zn-铁氧体磁心平面功率电感器的研究