Experimental Analysis of a Voice-Coil-Driven Jetting System for Micrograms Fluid Depositions in Electronics Assembly

摘要

The fundamental ability to drive automatically toindependent locations and deposit controlled masses of electronicspackaging adhesives makes dispensing an attractive solution in theelectronics assembly. The existence of modern technology such assmartphones, wearable devices (watches, glasses, etc.), and tabletshave led to tightly spaced, and high-density component packagingwhich further causes complex designs in the Printed Circuit Board(PCB) assembly. Advancements in dispensing technology becauseof these growing challenges in assembly has led to use of jettingsystems in this new arena. The process of jetting, unlike traditionaldispensing, has the ability to deposit controlled masses of packagingadhesives (also known as packaging fluids) at tightly spacedlocations with high accuracy and high speed and at much higherdeposition heights from the substrate. In this article, a voice-coildrivenjetting system is studied to assess the capability of jettingmicrograms of electronics packaging fluids. The article presentsexperimental analyses to study jetting of micrograms of fluiddroplets. Critical input factors are evaluated using a split-plotdesign of experiment (DOE) model to understand their significancein governing the responses. The responses studied in thiswork are the following: mass per droplet, dot diameter, and dispensequality. The applied DOE model will assist in developingprediction models to determine the optimal combination of factorsin achieving desired responses.