Recent Advances and Trends in Heterogeneous Integrations

摘要

The recent advances and trends in heterogeneousintegrations are presented in this study. Emphasis is placed on:(A) the definition of heterogeneous integrations, (B) the classificationsof heterogeneous integrations such as heterogeneous integrations on (a)organic substrates, (b) silicon substrates (through-silicon via interposers),(c) silicon substrates (bridges), (d) fan-out RDL (redistribution-layer)substrates, and (e) ceramic substrates, and (C) the examples of heterogeneousintegrations of chip-to-chip, chip-to-wafer,memory stacks,package-on-package, light-emitting diode, CMOS image sensors, microelectro-mechanical systems, vertical-cavity surface-emitting laser, andphotodetector.The trends of heterogeneous integrations are also presented.