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Effect of fabrication parameters on the thermophysical properties of sintered wicks for heat pipe applications

机译:制造参数对热管应用烧结灯芯热物理性质的影响

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Porous wicks for use in a loop heat pipe were sintered from copper and Monel powder. These wicks are characterized in terms of their porosity, liquid permeability, capillary pressure and thermal conductivity. The effect of fabrication parameters (particle size and sintering conditions) on these properties is studied. The experimentally measured values of permeability and capillary pressure were compared with correlations available in the literature. The Kozeny-Carman correlation was found to overpredict the experimental values of permeability; while the modified Young-Laplace equation was found to predict within 5% of the measured capillary pressure. Additionally, a model for predicting the thermal conductivity of sintered wicks is developed. First, the "two-sphere model' is used to relate the sintering conditions to the size of the connection (the 'neck') between two particles. Then, a finite element simulation is used to determine the thermal resistance of the bonded particles as a function of the neck between them. This thermal resistance is integrated in a random 3D resistor network as a means to model the multiple connections between spheres in a wick and to calculate the effective thermal conductivity of the wick. Results of the model are compared with experimental measurements of thermal conductivity of sintered copper wicks. Agreement between the model and the experimental measurements is good (within 15%) for sintering temperatures below 550 ℃, and within 26% for sintering temperatures up to 950 ℃. Finally, a generalized thermal conductivity chart is presented, which can be used to estimate the sintering temperature and time required to achieve the desired thermal conductivity.
机译:用铜和蒙乃尔粉末烧结用于循环热管的多孔灯芯。这些芯的孔隙率,液体渗透性,毛细压力和热导率均具有特征。研究了制造参数(粒度和烧结条件)对这些性能的影响。将渗透率和毛细管压力的实验测量值与文献中可用的相关性进行了比较。发现Kozeny-Carman相关性高估了渗透率的实验值。而修改后的Young-Laplace方程可预测所测毛细管压力的5%以内。另外,开发了用于预测烧结芯的热导率的模型。首先,使用“双球模型”将烧结条件与两个颗粒之间的连接尺寸(“颈”)相关联,然后使用有限元模拟确定粘结颗粒的热阻,如下此热阻集成在随机的3D电阻器网络中,可用来模拟灯芯中球之间的多个连接并计算灯芯的有效导热率,并将模型结果与烧结铜芯的热导率的实验测量。550℃以下的烧结温度与模型的实验结果吻合良好(在15%以内),而在950℃以下的烧结温度则模型与实验的测量值吻合良好(26%以内)。给出了图表,该图表可用于估计获得所需导热率所需的烧结温度和时间。

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