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Experimental study on the formation of TCR and thermal behavior of hard machining using TiAlN coated tools

机译:使用TiAln涂层工具形成TCR和硬加工热行为的实验研究

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Thermal contact resistance (TCR) is formatted at tool-chip interface during metal cutting process, which will influence on cutting temperature distribution. This study analyzed the formation mechanism of TCR in initial and stable stages in H13 hardened steel cutting process. Dry orthogonal cutting experiments were carried out with TiAlN coated tools. The cutting temperatures at the tool-chip contact zone and tool substrate were investigated. Scanning electron microscope (SEM) and energy dispersive spectrometry (EDS) were used to characterize the tool rake face and fracture cross-sectional morphology of TiAlN coated tool. By analyzing the experimental results, the TCR was caused by original defects of TiAlN coating such as particles and pits in the initial cutting stage. In the stable cutting stage, the TCR was generated by the Al2O3 oxide layer and the uneven adhesion of the chip material on tool rake face. A finite element (FE) model based on Arbitrary-Lagrangian-Eulerian (ALE) approach was applied to simulate the influence of TCR on cutting process. The FE simulation results indicated that the maximum cutting temperature of the tool rake face decreased with the increase of TCR. On the contrary, the maximum cutting temperature of tool-chip contact area increased with TCR. This proposed formation mechanism of TCR at tool-chip interface was helpful to better understand the cutting heat transfer in machining process. (C) 2019 Elsevier Ltd. All rights reserved.
机译:在金属切割过程中,在工具芯片界面中格式化热接触电阻(TCR),这将对切削温度分布产生影响。该研究分析了H13硬化钢切削过程中初始稳定阶段TCR的形成机制。用TiAln涂层工具进行干燥正交切割实验。研究了工具芯片接触区域和工具基板的切割温度。扫描电子显微镜(SEM)和能量分散光谱(EDS)用于表征TiAln涂层工具的工具耙面和断裂横截面形态。通过分析实验结果,TCR是由初始切割阶段中的颗粒和凹陷的原始缺陷引起的。在稳定的切割阶段,TCR由Al 2 O 3氧化物层产生和芯片材料对工具耙面的不均匀粘附。基于任意拉格朗日 - 欧拉(ALE)方法的有限元(FE)模型用于模拟TCR对切割过程的影响。 FE模拟结果表明,随着TCR的增加,刀具耙面的最大切割温度降低。相反,工具芯片接触面积的最大切削温度随TCR增加。在工具芯片界面处的TCR的这种形成机制有助于更好地了解加工过程中的切割传热。 (c)2019 Elsevier Ltd.保留所有权利。

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