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Indentation-induced subsurface tunneling cracks as a means for evaluating fracture toughness of brittle coatings

机译:压痕引起的地下隧道裂缝作为评估脆性涂层断裂韧性的一种手段

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摘要

When a plate glued to a compliant substrate is subject to indentation, cracks may initiate from its subsurface due to flexure. Upon increasing the load, the damage develops into a set of tunnel radial cracks which propagate stably under a diminishing stress field. This phenomenon is utilized here to extract fracture toughness K C for brittle materials in the form of thin plates or films. Experiments show that the SIF at the tip of the subsurface radial cracks is well approximated as K ~ P/c 3/2, where P is the indentation load and c the mean length of the crack fragments. Using a transparent substrate, c can be easily determined after unloading, from which K C is found. This simple and economic concept is applied to a wide variety of thin ceramic coatings, yielding toughness data consistent with literature values. Because the tip of the tunneling cracks are well removed from the contact site, the method circumvents certain complications encountered in common top-surface radial cracking techniques such as the effect of plastic deformation, residual stresses and crack extension after unloading. Although the present tests are limited to coating thicknesses >150 μm, it is believed that thinner coatings may be studied as well provided that the indenter radius is kept sufficiently small to insure that subsurface radial cracking dominates over all other failure modes.
机译:当粘贴在顺应性基材上的板受到压痕时,由于弯曲可能会从其下表面开始产生裂纹。随着载荷的增加,损伤发展成一组隧道径向裂纹,这些裂纹在应力场减小的情况下稳定地传播。这种现象在这里用于提取薄板或薄膜形式的脆性材料的断裂韧性K C 。实验表明,地下径向裂纹尖端的SIF近似为K〜P / c 3/2 ,其中P为压痕载荷,c为裂纹片段的平均长度。使用透明基板,卸载后可以很容易地确定c,从中可以找到K C 。这种简单而经济的概念适用于各种薄陶瓷涂层,其韧性数据与文献数据一致。由于隧穿裂纹的尖端已从接触部位充分去除,因此该方法避免了常见的顶表面径向裂纹技术遇到的某些复杂性,例如塑性变形,残余应力和卸载后裂纹扩展的影响。尽管目前的测试仅限于厚度> 150μm的涂层,但可以相信也可以研究更薄的涂层,前提是压头半径必须保持足够小,以确保地下径向裂纹在所有其他破坏模式中均占主导地位。

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