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首页> 外文期刊>International Journal of Fatigue >An investigation on crack growth rate of fatigue and induction heating thermo-mechanical fatigue (TMF) in Hastelloy X superalloy via LEFM, EPFM and integration models
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An investigation on crack growth rate of fatigue and induction heating thermo-mechanical fatigue (TMF) in Hastelloy X superalloy via LEFM, EPFM and integration models

机译:利用LEFM,EPFM和集成模型研究Hastelloy X高温合金的疲劳裂纹扩展和感应加热热机械疲劳(TMF)

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摘要

In this research, fatigue and induction heating thermo-mechanical fatigue (TMF) were performed on Hastelloy X superalloy in the small and large scale yielding in plane stresses mode. The crack growth rates were measured and formulated by fracture mechanics parameters. Furthermore, the fatigue life was predicted by employing resistance curves technique. The TMF behavior of this superalloy was investigated. The results demonstrated that in-phase loading TMF conditions lead to short fatigue life (more crack growth rate) at high strain amplitudes and temperatures up to 600 °C. For higher temperatures, the predominant damage was due to creep. A model based on damage contributions due to pure fatigue and cyclic creep has been presented for predicting TMF crack growth rates. Fracture mechanic method was used to suggest a model for fatigue part of TMF crack growth rate, while the temperature effects during TMF crack growth rate was considered to be due to cyclic creep. In addition the TMF crack healing or crack closure occur during application of induced eddy currents were investigated explicitly, as environmental effects of induction heating. The results show the higher current density in the crack tip area produced more heat and resulted in a significant rise in temperature. So it was concluded that the compressive thermal stress due to change of thermal expansion causes crack healing.
机译:在这项研究中,疲劳和感应加热热机械疲劳(TMF)在平面应力模式下以小尺寸和大尺寸屈服于Hastelloy X超级合金进行。测量裂纹扩展速率,并根据断裂力学参数制定。此外,通过采用电阻曲线技术来预测疲劳寿命。研究了该超级合金的TMF行为。结果表明,在高应变幅度和高达600°C的温度下,同相加载TMF条件导致疲劳寿命短(裂纹扩展率更高)。对于较高的温度,主要损坏是由于蠕变。已经提出了基于纯疲劳和循环蠕变造成的损伤贡献的模型,用于预测TMF裂纹的增长率。断裂力学方法被用来为TMF裂纹扩展速率的疲劳部分建立模型,而TMF裂纹扩展速率的温度效应被认为是循环蠕变引起的。另外,作为感应加热的环境效应,对TMF裂纹愈合或裂纹闭合的过程进行了明确研究,该过程是在施加感应涡流期间进行的。结果表明,裂纹尖端区域较高的电流密度产生更多的热量,并导致温度显着升高。因此可以得出结论,由于热膨胀变化而产生的压缩热应力会导致裂纹愈合。

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