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Evaluation of the crystallographic fatigue crack growth rate in a single-crystal nickel-base superalloy

机译:单晶镍基超合金中的结晶疲劳裂纹生长速率评价

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摘要

Cracks in single-crystal nickel-base superalloys have been observed to switch cracking mode from Mode I to crystallographic cracking. The crack propagation rate is usually higher on the crystallographic planes compared to Mode I, which is important to account for in crack growth life predictions. In this paper, a method to evaluate the crystallographic fatigue crack growth rate, based on a previously developed crystallographic crack driving force parameter, is presented. The crystallographic crack growth rate was determined by evaluating heat tints on the fracture surfaces of the test specimens from the experiments. Complicated crack geometries including multiple crystallographic crack fronts were modelled in a three dimensional finite element context, The data points of the crystallographic fatigue crack growth rate collapse on a narrow scatter band for the crystallographic cracks indicating a correlation with the previously developed crystallographic crack driving force.
机译:已经观察到单晶镍基高温合金中的裂缝,以将开裂模式从模式I切换到晶体裂解。与模式I相比,裂纹传播速率通常在结晶平面上较高,这对于在裂纹增长寿命预测中来说是重要的。本文介绍了一种基于先前显影的晶体裂纹驱动力参数来评估结晶疲劳裂纹生长速率的方法。通过从实验中评价试样的裂缝表面上的热色度来确定结晶裂纹生长速率。包括多个晶体裂纹前部的复杂裂纹几何形状被建模在三维有限元上下文中,结晶疲劳裂纹裂纹的数据点在窄散散射带上塌陷,用于结晶裂缝,表明与先前显影的晶体裂纹驱动力的相关性。

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