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首页> 外文期刊>International Communications in Heat and Mass Transfer >Optimum injection molding processing condition on EMI shielding effectiveness of stainless steel fiber filled polycarbonate composite
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Optimum injection molding processing condition on EMI shielding effectiveness of stainless steel fiber filled polycarbonate composite

机译:不锈钢纤维填充聚碳酸酯复合材料对EMI屏蔽效果的最佳注塑工艺条件

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摘要

Polycarbonate (PC) polymers mixed with conductive stainless steel fiber (SSF) is injection-molded under various injection process conditions. The composite formed is then tested for its capability to shield off electromagnetic field passing through. The effects of four major injection processing parameters including melt temperature, mold temperature, injection velocity and packing pressure on the electromagnetic interference (EMI) shielding effectiveness (SE) of PC filled with conductive SSF have been investigated. Taguchi method is adopted to obtain the optimum set of injection process parameters to acquire the maximum EMI shielding. It is observed that melt temperature and packing pressure significantly affect shielding effectiveness performance for injection-molded PC composites with SSF filler.
机译:在各种注塑工艺条件下,将与导电不锈钢纤维(SSF)混合的聚碳酸酯(PC)聚合物注塑成型。然后测试形成的复合材料的屏蔽电磁场的能力。研究了熔体温度,模具温度,注射速度和填充压力这四个主要注射工艺参数对填充有导电SSF的PC的电磁干扰(EMI)屏蔽效能(SE)的影响。采用Taguchi方法获得最佳的注入工艺参数集,以获得最大的EMI屏蔽。观察到,熔体温度和堆积压力显着影响具有SSF填料的注塑PC复合材料的屏蔽效能。

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