MICROMECHANISMS AND MECHANICS OF DAMAGE AND FRACTURE IN THIN FILM/SUBSTRATE SYSTEMS

L. L. Mishnaevsky; D. Gross Jr.

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MICROMECHANISMS AND MECHANICS OF DAMAGE AND FRACTURE IN THIN FILM/SUBSTRATE SYSTEMS

机译：薄膜/基板系统的微机械和损伤机制

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摘要

The purpose of this paper is to review the mechanisms and available theoretical methods for modeling the strength and failure of thin film/substrate systems.

机译：本文的目的是回顾建模薄膜/衬底系统的强度和失效的机理和可用的理论方法。

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来源
《International Applied Mechanics》 |2004年第2期|p.140-155|共16页
作者
L. L. Mishnaevsky; D. Gross Jr.;
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作者单位

University of Stuttgart, Germany;

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原文格式 PDF
正文语种 eng
中图分类应用力学;
关键词
thin film/substrate system; mechanisms of strength and failure; dislocation; cracking; decohesion; delamination; nanoindentation; fragmentation of films;

机译：薄膜/基体系统;强度和破坏机理;位错;开裂;脱聚;分层;纳米压痕;膜碎裂;

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专利

1. MICROMECHANISMS AND MECHANICS OF DAMAGE AND FRACTURE IN THIN FILM/SUBSTRATE SYSTEMS [J] . L. L. Mishnaevsky, D. Gross Jr. International Applied Mechanics . 2004,第2期

机译：薄膜/基板系统的微机械和损伤机制
2. MICROMECHANISMS AND MECHANICS OF DAMAGE AND FRACTURE IN THIN FILM/SUBSTRATE SYSTEMS [J] . L. L. Mishnaevsky, D. Gross Jr. International Applied Mechanics . 2004,第2期

机译：薄膜/基板系统中损伤和骨折的微机制和力学
3. MICROMECHANISMS AND MECHANICS OF DAMAGE AND FRACTURE IN THIN FILM/SUBSTRATE SYSTEMS [J] . L. L. Mishnaevsky, D. Gross Jr. International Applied Mechanics . 2004,第2期

机译：薄膜/基板系统中损伤和骨折的微机制和力学
4. Evaluation of interface strength between thin films fabricated on a silicon substrate for an advanced LSI on the basis of fracture mechanics concept [C] . Tadahiro Shibutani, Tetsu Tsuruga, Qiang Yu, International Conference on Processing amp; Manufacturing of Advanced Materials Pt.4; Jul 7-11, 2003; Leganes, Madrid, Spain . 2003

机译：基于断裂力学概念评估用于高级LSI的硅基板上制造的薄膜之间的界面强度
5. Mechanics of thin films on compliant substrates with applications in stretchable electronics. [D] . Chen, Chi. 2012

机译：顺应性基材上的薄膜力学及其在可拉伸电子产品中的应用。
6. Interface Strength Damage and Fracture between Ceramic Films and Metallic Substrates [O] . Lihong Liang, Linfeng Chen, Luobing Wu, 2021

机译：陶瓷薄膜和金属基材之间的界面强度损伤和裂缝
7. Interface reactions in the thin film-thin film and thin film-crystal substrate couples. Mainly in metal film-Si crystal systems. [O] . Akio Hiraki 1990

机译：薄膜薄膜和薄膜晶体基板耦合的界面反应。主要在金属薄膜 - Si晶体系统中。
8. Fracture of hard thin films using nanoindentation and nanoscratch techniques: A materials and mechanics approach [R] . Moody, N. R. , Medlin, D. , Hwang, R. Q. , 1998

机译：使用纳米压痕和纳米划痕技术的硬薄膜断裂：材料和力学方法

MICROMECHANISMS AND MECHANICS OF DAMAGE AND FRACTURE IN THIN FILM/SUBSTRATE SYSTEMS

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