THERMOSTRESSED STATE OF A PIEZOCERAMIC BODY WITH A PLANE CRACK IN A SYMMETRIC HEAT FLOW FROM ITS SURFACES

摘要

A problem of thermoelectroelasticity for a piezoelectric material with a plane crack of arbitrary shape in a symmetric heat flow from the crack surfaces is solved. The crack is in a plane perpendicular to the polarization axis. We establish a correspondence between the stress intensity factor (SIF) and electric displacement intensity factor (EDIF) for a piezoelectric material with a plane crack and the SIF for a thermoelastic isotropic material with a crack of the same shape under the same thermal load. This correspondence allows finding the SIF and EDIF for an electroelastic material from the solution of the thermoelastic problem. The SIF and EDIF for a penny-shape crack (for different cases of thermal loading) and a half-plane crack are found as examples.