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An all-digital self-calibrated delay-line based temperature sensor for VLSI thermal sensing and management

机译:用于VLSI热感测和管理的全数字自校准延迟线温度传感器

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This paper presents a low power self-calibrated delay-line based temperature sensor intended for Very Large Scale Integration (VLSI) thermal management applications. It proposes a fully digital automatic self-calibration method that removes the sensitivity to process variations in delay-line based temperature sensors. This method requires only one calibration block to calibrate multiple delay-line based temperature sensors sequentially. Both the proposed temperature sensors and the self-calibration method were verified experimentally on field programmable gate arrays (FPGAs) and on 65 nm and 0.13 mu m custom ICs. The measurement results on three 65 nm custom ICs show a resolution of 0.4 degrees C with 3 sigma errors of +/- 3.0 degrees C, from 20 to 80 degrees C. The proposed temperature sensors were implemented on a FPGA based VLSI thermal management system. Four microprocessor cores were mapped onto the corners of a Cyclone IV FPGA chip to emulate the VLSI load. Each core has a proposed temperature sensor close by. The runtime thermal profiles were obtained for four microprocessor cores, with eight different Dynamic Thermal Management (DTM) methods. Experimental results from different DTM techniques were studied. (C) 2015 Elsevier B.V. All rights reserved.
机译:本文提出了一种用于超大规模集成(VLSI)热管理应用的低功耗自校准延迟线温度传感器。它提出了一种全数字自动自校准方法,该方法消除了对基于延迟线的温度传感器中过程变化的敏感性。此方法仅需要一个校准块即可依次校准多个基于延迟线的温度传感器。提出的温度传感器和自校准方法均在现场可编程门阵列(FPGA)以及65 nm和0.13μm定制IC上进行了实验验证。在三个65 nm定制IC上的测量结果显示,分辨率为0.4摄氏度,从20到80摄氏度的3 sigma误差为+/- 3.0摄氏度。拟议的温度传感器在基于FPGA的VLSI热管理系统上实现。四个微处理器内核被映射到Cyclone IV FPGA芯片的角落,以模拟VLSI负载。每个核心附近都有一个建议的温度传感器。使用四个不同的动态热管理(DTM)方法获得了四个微处理器内核的运行时温度曲线。研究了来自不同DTM技术的实验结果。 (C)2015 Elsevier B.V.保留所有权利。

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