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UWB Short-Range Bifocusing Tomographic Imaging

机译:超宽带短程双聚焦层析成像

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摘要

In this paper, the capability of ultra-wideband (UWB) sensor arrays for tomographic imaging of electrically large objects in 2-D and 3-D environments is presented. One of the main concerns when imaging extended real objects is the capability of the system to correctly reconstruct the object cross-section electric properties. An imaging method using a UWB multifrequency bifocusing (UWB-MFBF) operator with good tomographic imaging capabilities is presented, and numerical simulations are conducted to obtain the basic geometry and sampling parameters for a good-quality image reconstruction for geometrical and electrical parameters. Canonical-shape experimental reconstructions are performed to validate the established criteria.
机译:在本文中,介绍了超宽带(UWB)传感器阵列在2-D和3-D环境中对大型电气物体进行层析成像的功能。对扩展的真实对象进行成像时,主要关注的问题之一是系统正确重建对象横截面电特性的能力。提出了一种使用具有良好的层析成像能力的UWB多频双聚焦(UWB-MFBF)算子的成像方法,并进行了数值模拟,以获得基本的几何形状和采样参数,从而可以对几何和电参数进行高质量的图像重建。进行规范形状的实验重建以验证已建立的标准。

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