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首页> 外文期刊>Ceramics International >Deposition and Characterization of CVD-Tungsten and Tungsten Carbonitrides on (100) Si
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Deposition and Characterization of CVD-Tungsten and Tungsten Carbonitrides on (100) Si

机译:(100)Si上CVD钨和碳氮化钨的沉积和表征

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摘要

Two different precursors were used to deposit W films on Si-W(CO)_6 and WCl_6. By pyrolytic decomposition of W(CO)_6 at 400℃ in argon atmosphere W thin films with well-expressed textured structure were deposited on (100)Si substrates. By hydrogen reduction of WCl_6 at 750℃ in Ar, polycrystalline W films were deposited. By the carbonyl process and in the presence of ammonia and acetone, WC_xN_y thin films were obtained. Reflection High Energy Electron Diffraction (RHEED) method was used for structural characterization of the films. Temperature dependence of the electrical resistance of the films in the range 4.2-300 K was studied and the results are discussed in terms of films structure and composition.
机译:使用两种不同的前体在Si-W(CO)_6和WCl_6上沉积W膜。通过在氩气中于400℃下热分解W(CO)_6,在(100)Si衬底上沉积具有良好结构纹理的W薄膜。通过在Ar中750℃下WCl_6的氢还原,沉积了多晶W膜。通过羰基工艺并且在氨和丙酮的存在下,获得了WC_xN_y薄膜。反射高能电子衍射(RHEED)方法用于薄膜的结构表征。研究了膜电阻在4.2-300 K范围内的温度依赖性,并根据膜的结构和组成讨论了结果。

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