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On-Chip Detection of Process Shift and Process Spread for Post-Silicon Diagnosis and Model-Hardware Correlation

机译:用于硅后诊断和模型硬件关联的过程转移和过程扩展的片内检测

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This paper proposes the use of on-chip monitor circuits to detect process shift and process spread for post-silicon diagnosis and model-hardware correlation. The amounts of shift and spread allow test engineers to decide the correct test strategy. Monitor structures suitable for detection of process shift and process spread are discussed. Test chips targeting a nominal process corner as well as 4 other corners of "slow-slow", "fast-fast", "slow-fast" and "fast-slow" are fabricated in a 65 nm process. The monitor structures correctly detects the location of each chip in the process space. The outputs of the monitor structures are further analyzed and decomposed into the process variations in threshold voltage and gate length for model-hardware correlation. Path delay predictions match closely with the silicon values using the extracted parameter shifts. On-chip monitors capable of detecting process shift and process spread are helpful for performance prediction of digital and analog circuits, adaptive delay testing and post-silicon statistical analysis.
机译:本文提出了使用片上监控器电路来检测工艺偏移和工艺扩展,以进行硅后诊断和模型硬件关联的方法。变动和点差的数量使测试工程师可以决定正确的测试策略。讨论了适用于检测过程偏移和过程扩展的监视器结构。针对标称工艺角以及“慢-慢”,“快-快”,“慢-快”和“快-慢”的其他4个角的测试芯片是在65 nm工艺中制造的。监视器结构正确地检测每个芯片在处理空间中的位置。监控器结构的输出将进一步分析,并分解为阈值电压和栅极长度的过程变化,以实现模型-硬件​​相关性。使用提取的参数偏移,路径延迟预测与硅值紧密匹配。能够检测过程偏移和过程扩展的片上监视器有助于数字和模拟电路的性能预测,自适应延迟测试以及硅后统计分析。

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