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On Density-Gradient Modeling of Tunneling through Insulators

机译:绝缘子隧穿的密度梯度建模

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摘要

The density gradient (DG) model is tested for its ability to describe tunneling currents through thin insulating barriers. Simulations of single barriers (MOS diodes, MOS-FETs) and double barriers (RTDs) show the limitations of the DG model. For comparison, direct tunneling currents are calculated with the Schroedinger-Bardeen method and used as benchmark. The negative differential resistance (NDR) observed in simulating tunneling currents with the DG model turns out to be an artifact related to large density differences in the semiconductor regions. Such spurious NDR occurs both for single and double barriers and vanishes, if all semiconductor regions are equally doped.
机译:测试了密度梯度(DG)模型描述通过薄绝缘层的隧道电流的能力。单势垒(MOS二极管,MOS-FET)和双势垒(RTD)的仿真显示了DG模型的局限性。为了进行比较,直接隧道电流使用Schroedinger-Bardeen方法计算并用作基准。事实证明,使用DG模型模拟隧道电流时观察到的负差分电阻(NDR)是与半导体区域中大的密度差异相关的伪影。如果所有半导体区域均被均匀掺杂,则这种寄生NDR会同时出现在单势垒和双势垒中,并且消失。

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