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Variability: Modeling and Its Impact on Design

机译:可变性:建模及其对设计的影响

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As the technology scaling approaching nano-scale region, variability in device performance becomes a major issue in the design of integrated circuits. Besides the growing amount of variability, the statistical nature of the variability is changing as the progress of technology generation. In the past, die-to-die variability, which is well managed by the worst case design technique, dominates over within-die variability. In present and the future, the amount of within-die variability is increasing and it casts a challenge in design methodology. This paper first shows measured results of variability in three different processes of 0.35, 0.18, and 0.13 μm technologies, and explains the above mentioned trend of variability. An example of modeling for the within-die variability is explained. The impact of within-die random variability on circuit performance is demonstrated using a simple numerical example. It shows that a circuit that is designed optimally under the assumption of deterministic delay is now most susceptible to random fluctuation in delay, which clearly indicates the requirement of statistical design methodology.
机译:随着技术规模接近纳米尺度区域,器件性能的可变性成为集成电路设计中的主要问题。除了不断增加的可变性外,随着技术的发展,可变性的统计性质也在发生变化。过去,通过最坏情况的设计技术可以很好地管理管芯之间的差异性,而在管芯内部的差异性方面占主导地位。在现在和将来,芯片内可变性的数量正在增加,这对设计方法提出了挑战。本文首先显示了在0.35、0.18和0.13μm技术的三个不同过程中变异性的测量结果,并解释了上述变异性趋势。解释了模具内变异性的建模示例。使用一个简单的数值示例说明了芯片内随机变化对电路性能的影响。它表明,在确定性延迟的假设下进行最佳设计的电路现在最容易受到延迟随机波动的影响,这清楚地表明了统计设计方法的要求。

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