首页> 外文期刊>電子情報通信学会技術研究報告 >Design Consideration of High Power LED Arrays for Backlight Unit Applications
【24h】

Design Consideration of High Power LED Arrays for Backlight Unit Applications

机译:用于背光单元应用的大功率LED阵列的设计考虑

获取原文
获取原文并翻译 | 示例
       

摘要

Thermal effects in LED arrays were investigated as a function of LED power, size, and spacing. For high power LEDs, the increase in junction temperature due to a high driving current plays an important role in LED performance, e.g. conversion efficiency, optical degradation, etc. Since the maximum driving power that determines LED brightness is limited by the critical junction temperature, thermal influence from adjacent LEDs in an array has to be also taken into account carefully. The relationship between maximum allowed driving power and LED BLU design parameters are discussed along with other factors to be concerned.
机译:研究了LED阵列中的热效应与LED功率,尺寸和间距的关系。对于高功率LED,由于高驱动电流导致的结温升高在LED性能(例如LED功率)中起着重要作用。转换效率,光学性能下降等。由于决定LED亮度的最大驱动功率受到临界结温的限制,因此还必须仔细考虑阵列中相邻LED的热影响。讨论了最大允许驱动功率与LED BLU设计参数之间的关系以及其他需要考虑的因素。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号