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首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >Design and Optimization of SHF Composite FBAR Resonators
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Design and Optimization of SHF Composite FBAR Resonators

机译:SHF复合FBAR谐振器的设计与优化

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We propose an apodization technique-based composite thin-film bulk acoustic wave resonator (c-FBAR) design to enable the displacement and strain energy confinement at the central section of the resonator while in operation at the resonance mode. Sinc-shaped AlN on Silicon on Insulator apodized c-FBARs is designed to attain close to 90% energy localization. In this paper, a single crystal silicon as the mechanical layer and an AlN piezoelectric material as the transducer layer of the resonator implemented by InvenSense Inc.'s AlN MEMS-CMOS platform renders an asymmetric feature to the traditional FBAR resonator. The nature of composite thin-film piezoelectric on substrate FBAR resonators in the super high-frequency (SHF) range is studied in detail. Furthermore, a complete deembedding procedure to extract the resonator parameters from the CMOS + MEMS measured data is also explained meticulously. A complete equivalent circuit modeling for c-FBAR operating in the SHF is provided. Measurement data statistics show that sinc c-FBAR features superior electromechanical coupling coefficient (kteff2) than that of pentagon c-FBAR. As a result, we successfully demonstrate a sinc c-FBAR resonator operating at 3.264 GHz with an electromechanical coupling coefficient of 2.12%, a loaded quality factor (Q) of 790 and an unloaded Q of 2507.
机译:我们提出了一种基于变迹技术的复合薄膜体声波谐振器(c-FBAR)设计,以使在谐振模式下工作时,位移和应变能限制在谐振器的中心部分。绝缘体上切趾的c-FBAR硅上的Sinc形AlN旨在实现接近90%的能量局部化。在本文中,由InvenSense Inc.的AlN MEMS-CMOS平台实现的单晶硅作为机械层,而AlN压电材料作为谐振器的换能器层,使传统FBAR谐振器具有非对称特征。详细研究了超高频(SHF)范围内基板FBAR谐振器上复合薄膜压电材料的性质。此外,还详细说明了从CMOS + MEMS测量数据中提取谐振器参数的完整去嵌入过程。提供了在SHF中运行的c-FBAR的完整等效电路模型。测量数据统计表明,与五边形c-FBAR相比,sinc c-FBAR具有更好的机电耦合系数(k teff 2 )。结果,我们成功地证明了在3.264 GHz频率下工作的Sinc c-FBAR谐振器,其机电耦合系数为2.12%,负载质量因数(Q)为790,而负载Q为2507。

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