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首页> 外文期刊>IEEE Transactions on Speech and Audio Proceessing >Chip design of portable speech memopad suitable for persons with visual disabilities
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Chip design of portable speech memopad suitable for persons with visual disabilities

机译:适合视障人士的便携式语音记事簿的芯片设计

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This paper presents the design of a speech recognition and compression chip for portable memopad devices, especially suitable for use by the visually impaired. The proposed chip design is based on several cores of which they can be regarded as intellectual property (IP) cores to be used for a variety of speech-related application systems. A cepstrum extraction core and a dynamic warping core are designed for mapping the speech recognition algorithms. In the cepstrum extraction core, a novel architecture computes the autocorrelation between the overlapping frames using two pairs of shift registers and an intelligent accumulation procedure. The architecture of the dynamic time warping core uses only a single processing element, and is based on our extensive study of the relationship among the nodes in the dynamic time warping lattice. Bit rate is the key factor affecting the memory size for speech compression; therefore, a very low bit-rate speech coder is used. The speech coder exploits a line-spectrum-based interpolation method, which yields fine quality synthesized speech despite the low 1.6 kbps bit rate. The 1.6 kbps vocoder core is cost-effective, and it integrates both encoder and decoder algorithms. The proposed design has been tested via hardware simulations on Xilinx Virtex series FPGAs and a semi-custom chip fabricated by 0.35 μm CMOS single-poly-four-metal technology on a die size approximately 4.46×4.46 mm2.
机译:本文提出了一种便携式记事本设备的语音识别和压缩芯片的设计,特别适合视障人士使用。所提出的芯片设计基于几个内核,可以将它们视为可用于各种语音相关应用系统的知识产权(IP)内核。设计了倒谱提取核心和动态扭曲核心,以映射语音识别算法。在倒谱提取核心中,一种新颖的体系结构使用两对移位寄存器和智能累加程序来计算重叠帧之间的自相关。动态时间规整核心的体系结构仅使用单个处理元素,并且基于我们对动态时间规整网格中节点之间关系的广泛研究。比特率是影响语音压缩存储器大小的关键因素。因此,使用了非常低的比特率语音编码器。语音编码器采用基于线谱的插值方法,尽管比特率低至1.6 kbps,但仍可产生高质量的合成语音。 1.6 kbps声码器内核具有成本效益,并且集成了编码器和解码器算法。拟议的设计已通过Xilinx Virtex系列FPGA上的硬件仿真和采用0.35μmCMOS单-多-四金属技术制造的半定制芯片进行了测试,芯片尺寸约为4.46×4.46 mm2。

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