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首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >A Highly Manufacturable 75–150 VDC GaN-SiC RF Technology for Radars and Particle Accelerators
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A Highly Manufacturable 75–150 VDC GaN-SiC RF Technology for Radars and Particle Accelerators

机译:适用于雷达和粒子加速器的高度可制造的75–150 VDC GaN-SiC RF技术

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摘要

The latest advances in a GaN on SiC RF technology for powering radar systems and particle accelerators are reported. Unlike research-grade technologies based on novel materials, the technology presented here is highly manufacturable as it is based on commercially available GaN on SiC epitaxial wafers and the AlGaN/GaN high electron mobility transistor (HEMT) structure. However, compared to state-of-the-art GaN on SiC RF technology operating from 28 to 50 V, the approach and results presented in this paper explore core transistor designs that are suitable for operation with a bias voltage ranging from 75 to 150 VDC. Wafer processing is similar to typical GaN HEMT process modules for commercially available 28 - 50 V technology and therefore can be easily implemented in existing GaN on SiC manufacturing lines. The approach results in power densities > 10 W/mm at hundred watts power levels which is very desirable in mega-watts RF systems. The results presented in this publication illustrate some of the benefits achievable in radar systems and RF power sources for particle accelerators.
机译:据报道,GaN SiC射频技术可为雷达系统和粒子加速器提供动力。与基于新型材料的研究级技术不同,此处介绍的技术具有很高的可制造性,因为它基于SiC外延晶片上的市售GaN和AlGaN / GaN高电子迁移率晶体管(HEMT)结构。但是,与工作在28至50 V的SiC RF技术上的最新GaN相比,本文介绍的方法和结果探索了适用于在75至150 VDC偏置电压下工作的核心晶体管设计。 。晶圆处理类似于用于商用28-50 V技术的典型GaN HEMT工艺模块,因此可以在SiC生产线上的现有GaN中轻松实现。该方法在百瓦功率水平下导致功率密度> 10 W / mm,这在兆瓦RF系统中非常需要。该出版物中呈现的结果说明了雷达系统和粒子加速器的RF电源可实现的一些优势。

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