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Silicon Carbide Power MOSFET Model and Parameter Extraction Sequence

机译:碳化硅功率MOSFET模型和参数提取顺序

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A compact circuit simulator model is used to describe the performance of a 2-kV, 5-A 4-H silicon carbide (SiC) power DiMOSFET and to perform a detailed comparison with the performance of a widely used 400-V, 5-A Si power MOSFET. The model's channel current expressions are unique in that they include the channel regions at the corners of the square or hexagonal cells that turn on at lower gate voltages and the enhanced linear region transconductance due to diffusion in the nonuniformly doped channel. It is shown that the model accurately describes the static and dynamic performance of both the Si and SiC devices and that the diffusion-enhanced channel conductance is essential to describe the SiC DiMOSFET on-state characteristics. The detailed device comparisons reveal that both the on-state performance and switching performance at 25degC are similar between the 400-V Si and 2-kV SiC MOSFETs, with the exception that the SiC device requires twice the gate drive voltage. The main difference between the devices is that the SiC has a five times higher voltage rating without an increase in the specific on-resistance. At higher temperatures (above 100degC), the Si device has a severe reduction in conduction capability, whereas the SiC on-resistance is only minimally affected
机译:紧凑型电路仿真器模型用于描述2kV,5-A 4-H碳化硅(SiC)功率DiMOSFET的性能,并与广泛使用的400V 5-A的性能进行详细比较硅功率MOSFET。该模型的沟道电流表达式是独特的,因为它们包括正方形或六角形单元拐角处的沟道区域,这些区域在较低的栅极电压时导通,并且由于在非均匀掺杂沟道中的扩散而增强了线性区域的跨导。结果表明,该模型准确地描述了Si和SiC器件的静态和动态性能,并且扩散增强型沟道电导对于描述SiC DiMOSFET的导通状态特性至关重要。详细的器件比较显示,在400V Si和2kV SiC MOSFET之间,在25℃下的导通状态性能和开关性能​​都相似,不同之处在于SiC器件需要两倍的栅极驱动电压。器件之间的主要区别在于,SiC的额定电压高五倍,而导通电阻却没有增加。在较高的温度下(高于100℃),Si器件的导通能力大大降低,而SiC的导通电阻仅受到最小的影响

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