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首页> 外文期刊>IEEE Transactions on Nuclear Science >Electron irradiation effects on photoconductive semiconductor switches (PCSSs) used in sub-nanosecond transient generators
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Electron irradiation effects on photoconductive semiconductor switches (PCSSs) used in sub-nanosecond transient generators

机译:电子辐射对亚纳秒瞬态发生器中使用的光电导半导体开关(PCSS)的影响

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Radiation-induced damage occurs in GaAs photoconductive semiconductor switches used in sub-nanosecond transient generators when subjected to 600 keV and 6 MeV electron irradiation. These switches are made from semi-insulating (SI) compensated material through a EL2/carbon compensation mechanism, and the liquid encapsulated Czochralski process. New defect levels are formed as a result of the non-ionizing energy loss (NIEL) process. The formation of new defect levels in the device alters the compensating balance between the existing deep level EL2 trap/donors and carbon acceptors, and changes the material properties. As a result, two important parameters of the device are adversely affected-the hold-off voltage of the switch at the pulse-charging (off) state, and the rise time during the conduction (on) state. The hold-off voltage shifts to a lower value since there are more trap-filled regions available that can fill up and alter the homogenous nature of the device material. Unstable filamentary conduction then occurs at a lower voltage and leads to premature breakdown. As with EL2 trap levels, new defect states induced by electron irradiation will further contribute to the delay in the rise time of the switch. The rise time determines the maximum energy transferred to the load. The electron damage mechanism and its effects on the switch characteristics depend on the material properties. Intrinsic material, or material made through compensation other than through the deep donor and shallow acceptor balancing process are not expected to behave similarly. Simulation results at higher bias show a marked degradation of material properties. The switch current-voltage (I-V) characteristic when the bias increases to the kilovolt range is similar to trap-dominated semiconductors. An initial sublinear current regime at low bias is followed by a super-linear regime of current flow at higher bias, and is in agreement with earlier observations.
机译:亚纳秒瞬态发生器中使用的GaAs光电导半导体开关在受到600 keV和6 MeV电子辐照时会发生辐射诱发的损坏。这些开关由通过EL2 /碳补偿机制的半绝缘(SI)补偿材料以及液体封装的切克劳斯基工艺制成。非电离能量损失(NIEL)过程的结果是形成了新的缺陷水平。设备中新缺陷水平的形成改变了现有深水平EL2陷阱/施主与碳受体之间的补偿平衡,并改变了材料性能。结果,器件的两个重要参数受到不利影响:处于脉冲充电(关闭)状态的开关的保持电压,以及处于导通(接通)状态的上升时间。由于存在更多可用的陷阱填充区域,可以填充并改变器件材料的均匀特性,因此将保持电压移至较低值。然后,在较低电压下会发生不稳定的丝状导电,并导致过早击穿。与EL2陷阱能级一样,由电子辐照引起的新缺陷状态将进一步导致开关上升时间的延迟。上升时间决定了传递给负载的最大能量。电子损伤机理及其对开关特性的影响取决于材料特性。本征材料或通过补偿而不是通过深施主和浅受体平衡过程制造的材料,预期不会表现出相似的行为。高偏置下的仿真结果表明材料性能明显下降。当偏置增加到千伏范围时,开关电流-电压(I-V)特性类似于陷阱占优势的半导体。低偏置时的初始亚线性电流状态,然后是高偏置时的超线性电流状态,这与早期的观察结果一致。

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