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RFIC's for mobile communication systems using SiGe bipolar technology

机译:使用SiGe双极技术的移动通信系统的RFIC

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摘要

We report on design aspects and the implementation of RF integrated circuits (RFIC's) using TEMIC's SiGe heterojunction bipolar transistor (HBT) technology. SiGe HBT's with 50-GHz f/sub T/ and f/sub max/ were obtained by a production process including polysilicon resistors, nitride capacitors, and spiral inductors showing Q values up to 10. RF noise figures down to 1 dB at 2 GHz with an associated gain of 14-dB and 1-kHz 1/f corner frequency were obtained. The differences between the device parameters of Si bipolar junction transistor (BJT) and SiGe HBT technology and their influence on IC design are discussed. Design and measurement results of RFIC's, including a low-noise amplifier (LNA) and a power amplifier (PA) for application in a 1.9-GHz digital enhanced cordless telecommunications (DECT) RF front-end and 900-MHz preamplifier for a global system for mobile communication (GSM) power module are presented.
机译:我们使用TEMIC的SiGe异质结双极晶体管(HBT)技术报告设计方面和RF集成电路(RFIC)的实现。具有50 GHz f / sub T /和f / sub max /的SiGe HBT是通过包括Q值高达10的多晶硅电阻器,氮化物电容器和螺旋电感器的生产过程获得的。RF噪声系数在2 GHz时低至1 dB具有14dB的相关增益和1-kHz 1 / f转折频率。讨论了Si双极结晶体管(BJT)和SiGe HBT技术的器件参数之间的差异以及它们对IC设计的影响。 RFIC的设计和测量结果,包括用于1.9 GHz数字增强型无绳电信(DECT)RF前端和用于全球系统的900 MHz前置放大器的低噪声放大器(LNA)和功率放大器(PA)介绍了用于移动通信(GSM)的电源模块。

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