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首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >3-D Low-Loss Coplanar Waveguide Transmission Lines in Multilayer MMICs
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3-D Low-Loss Coplanar Waveguide Transmission Lines in Multilayer MMICs

机译:多层MMIC中的3D低损耗共面波导传输线

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摘要

Newly developed transmission-line structures using the great flexibility of three-dimensional multilayer technology have been designed and fabricated. In this paper, we demonstrate that monolithic microwave integrated circuit (MMIC) coplanar waveguide transmission lines with a wide range of characteristic impedances can easily be designed using the multilayer technique. Furthermore, this implementation can avoid the well-known current crowding effects on the conductor edges minimizing dissipation loss. The system of three layers of metals and two layers of sandwich polyimide as dielectrics was employed. The fabricated transmission lines have been characterized providing a wide range of impedances from 10 to 70 OMEGA. In addition, the effects of unintentional horizontal and vertical coupling in multilayer MMICs have been investigated. The results indicated that an optimum separation of 75 (mu)m is necessary for negligible coupling (approx -30 dB).
机译:已经设计和制造了利用三维多层技术的巨大灵活性的新开发的传输线结构。在本文中,我们证明了使用多层技术可以轻松设计具有广泛特征阻抗的单片微波集成电路(MMIC)共面波导传输线。此外,该实施方式可以避免在导体边缘上的众所周知的电流拥挤效应,从而使耗散损耗最小。采用三层金属和两层夹心聚酰亚胺作为电介质的系统。所制造的传输线的特征在于可提供10至70Ω的广泛阻抗。此外,还研究了多层MMIC中意外的水平和垂直耦合的影响。结果表明,对于可忽略的耦合(大约-30 dB),必须有75μm的最佳间隔。

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