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An Analysis of Perfect-Magnetic-Coupling Ultra-Low-Loss Micromachined SMIS RF Transformers for RFIC Applications

机译:用于RFIC的磁耦合超低损耗微机械SMIS射频变压器的分析

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摘要

Selective removal of the silicon underneath a set of single-turn multilayer interlaced stacked (SMIS) radio-frequency (RF) transformers with nearly perfect magnetic-coupling factor (kIM~1) and high resistive-coupling factor (kRe) is demonstrated. This process is based on the inductively coupled-plasma (ICP) deep trench technology. Improvement of 20.6 and 15.7 dB in isolation (S21) were achieved at 5.2 and 8 GHz, respectively, for a dummy open device after the backside ICP etching. Q-factor increases of 102% (from 4.96 to 10.03) and 23.2% (from 2.24 to 2.76), GAmax increases of 11.8% (from 0.76 to 0.85) and 4.5% (from 0.88 to 0.92), and NFmin decreases of 0.49 dB (from 1.22 to 0.73 dB) and 0.19 dB (from 0.55 to 0.36 dB) were achieved at 5.2 and 8 GHz, respectively, for an SMIS transformer with an overall dimension of 170times240 mum2 after the backside ICP etching. The GAmax of 0.85 and 0.92 are both state-of-the-art results among all reported on-chip transformers. Furthermore, the reasons why the SMIS transformer exhibits better performances than the traditional bifilar and the traditional stacked transformer are explained. These results show that the micromachined SMIS transformers are very promising for RF integrated circuit applications
机译:展示了选择性去除一组单匝多层隔行交错堆叠(SMIS)射频(RF)变压器下方的硅的方法,这些变压器具有近乎完美的磁耦合系数(kIM〜1)和高电阻耦合系数(kRe)。此过程基于感应耦合等离子体(ICP)深沟槽技术。对于背面ICP蚀刻后的虚拟开路器件,分别在5.2 GHz和8 GHz时隔离度(S21)分别提高了20.6 dB和15.7 dB。 Q因子增加102%(从4.96到10.03)和23.2%(从2.24到2.76),GAmax增加11.8%(从0.76到0.85)和4.5%(从0.88到0.92),NFmin减少0.49 dB在背面ICP蚀刻后,SMIS变压器的总尺寸为170×240 mum2,分别在5.2 GHz和8 GHz时达到了1.22至0.73 dB(0.12 dB)(0.55至0.36 dB)(0.15 dB)。 GAmax为0.85和0.92均为所有已报道的片上变压器的最新结果。此外,解释了为什么SMIS变压器表现出比传统双线和传统叠层变压器更好的原因。这些结果表明,微加工的SMIS变压器对于RF集成电路应用非常有前途

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