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Analysis and Design of Millimeter-Wave Power Amplifier Using Stacked-FET Structure

机译:堆叠式FET结构的毫米波功率放大器的分析与设计

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摘要

A new analysis methodology for millimeter-wave stacked-FET power amplifier design is proposed with a focus on the output power improvement by adjusting the complex load-admittance of each stacked-transistor. From this analysis, it is shown that there exist fundamental limitations on the maximum FET-stacking number and the operation frequency with given FET characteristics. Moreover, comprehensive analysis is performed to understand the effect of each FET parameter in limiting the number of stacks and output power. Based on this, a simple design method of compensation is proposed to further increase the number of the stacks and enhance the output power. To verify analyses, various high-frequency stacked-FET PA MMICs are designed and fabricated at different frequencies with pHEMTs, mHEMTs, and CMOSFETs, which all have different maximum transition frequencies ('s). This paper presents comprehensive analysis to identify the limitation of the stacked-FET amplifiers at millimeter-wave frequencies and presents a new design methodology to further improve the output power performance at high frequencies.
机译:提出了一种针对毫米波堆叠式FET功率放大器设计的新分析方法,其重点是通过调整每个堆叠式晶体管的复数负载导纳来改善输出功率。从该分析表明,在给定的FET特性下,最大FET堆叠数和工作频率存在基本限制。此外,进行了综合分析以了解每个FET参数在限制电池组数量和输出功率方面的作用。基于此,提出了一种简单的补偿设计方法,以进一步增加堆叠的数量并提高输出功率。为了验证分析结果,使用pHEMT,mHEMT和CMOSFET以不同的频率设计和制造了各种高频堆叠FET PA MMIC,它们都具有不同的最大过渡频率。本文提出了全面的分析方法,以确定在毫米波频率下堆叠式FET放大器的局限性,并提出了一种新的设计方法,以进一步改善高频下的输出功率性能。

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