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Structural Analysis of CoFeB/MgO-Based Perpendicular MTJs With Junction Size of 20 nm by STEM Tomography

机译:茎断层扫描的结尺寸为20nm的CoFeB / MgO的垂直MTJ的结构分析

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We have successfully observed the process-induced microstructure of the ultrafine CoFeB–MgO-based magnetic tunnel junctions with a perpendicular easy axis (p-MTJs) down to junction size of less than 20 nm using scanning transmission electron microscope (STEM) tomography combined with energy-dispersive X-ray spectroscopy (EDX). This made it possible to examine 3-dimensionally the precise structural information inside the entire MTJ. By this, the root cause of the change in the resistance of the MTJ was found to be the altered region consisting of Fe-dipping attached to the edge of the MgO and ultrathin TaO layer uniformly formed on the MTJ surface. This altered region is caused by etching during patterning of the MTJ, and the resistance value of the MTJ changes depending on the degree of adhesion of insulating TaO and Fe atoms at the edge of the MgO barrier layer. Furthermore, it was found that the unevenness of the MgO/CoFeB interface inside the MTJ was not a factor that caused the change in the thickness of the MgO barrier layer in the current process. Our results show that STEM tomography is an effective tool for failure analysis to clarify the relationship between the detailed structure of fine MTJs and magnetic properties. Unlike the conventional cross-sectional STEM observation, since the STEM tomographic observation includes the whole view of the MTJ, this enables higher resolution observation as the MTJ size decreases without overlooking the cause of failure inside the MTJ.
机译:我们已经成功地观察了使用扫描透射电子显微镜(Stem)断层扫描的垂直易轴(P-MTJs)与垂直易轴(P-MTJs)的垂直易轴(P-MTJs)的微观结构诱导的超细易轴(P-MTJs)。能量分散X射线光谱(EDX)。这使得可以在整个MTJ内进行三维结构信息。由此,发现MTJ的电阻变化的根本原因是由均匀地形成在MTJ表面上的MgO和超薄Tao层的Fe浸渍组成的改变区域。该改变的区域是通过在MTJ的图案化期间蚀刻而引起的,并且MTJ的电阻值根据MgO阻挡层边缘处的绝缘TaO和Fe原子的粘附程度而变化。此外,发现MTJ内的MgO / CoFeB接口的不均匀性不是导致当前过程中MgO阻挡层厚度变化的因素。我们的结果表明,阀杆断层扫描是故障分析的有效工具,以阐明细MTJS和磁性的详细结构之间的关系。与传统的横截面杆观察不同,由于阀杆断层观察包括MTJ的整个视图,这使得能够在MTJ尺寸减小而不俯视MTJ内的故障原因的情况下实现更高的分辨率观察。

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