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首页> 外文期刊>IEEE Transactions on Magnetics >3-D circuital approach for the analysis of the electromagnetic transient diffusion of heat and current in conductive bodies
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3-D circuital approach for the analysis of the electromagnetic transient diffusion of heat and current in conductive bodies

机译:3-D电路方法,用于分析导体中热量和电流的电磁瞬态扩散

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摘要

The present paper deals with the numerical simulation of the coupled problem of the transient diffusion of heat and current in conductive bodies. Moreover how to use the present approach taking into account the respective motion among systems of conductors is indicated in the paper. The final part of the paper deals with two examples of numerical calculation used to test the effectiveness of the method proposed and to show its practical possibilities. The results of the simulations are summarized in tables and pictures and are compared to experimental data and to numerical results obtained by means of other computer codes.
机译:本文研究了热和电流在导体中瞬态扩散耦合问题的数值模拟。此外,在本文中指出了如何使用本方法,并考虑了导体系统之间的各自运动。本文的最后一部分讨论了两个数值计算示例,用于测试所提出方法的有效性并显示其实际可能性。仿真结果汇总在表格和图片中,并与实验数据和通过其他计算机代码获得的数值结果进行比较。

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