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首页> 外文期刊>IEEE Transactions on Magnetics >Increasing the resistivity of electrodeposited high B/sub S/ CoNiFe thin film
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Increasing the resistivity of electrodeposited high B/sub S/ CoNiFe thin film

机译:增加电沉积高B / sub S / CoNiFe薄膜的电阻率

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In order to increase the resistivity of electrodeposited high B/sub S/ CoNiFe thin film, the effect of an organic additive such as diethylenetriamine (DET) added to the plating bath was investigated. The values of /spl rho/ and H/sub C/ were gradually increased as a function of DET concentration. The desirable soft magnetic CoNiFe thin film with /spl rho/=25-90 /spl mu//spl Omega/-cm under the conditions of B/sub S/<1.9 T and H/sub C/>2.5 Oe was developed as function of carbon in the deposited films. Additionally, the high resistivity CoNiFe thin film with /spl rho/=130 /spl mu//spl Omega/-cm was established under the conditions of B/sub S/=1.7 T and H/sub C/>6 0e.
机译:为了增加电沉积的高B / sub S / CoNiFe薄膜的电阻率,研究了将有机添加剂(例如二亚乙基三胺(DET))添加到电镀浴中的效果。 / spl rho /和H / sub C /的值根据DET浓度逐渐增加。在B / sub S / <1.9 T和H / sub C /> 2.5 Oe的条件下,开发了理想的具有/ spl rho / = 25-90 / spl mu // spl Omega / -cm的软磁CoNiFe薄膜。沉积膜中碳的功能。另外,在B / sub S / = 1.7 T和H / sub C /> 6 0e的条件下,建立了具有/ spl rho / = 130 / spl mu // spl Omega / -cm的高电阻率CoNiFe薄膜。

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