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Co-Ferrite Thin Films With Perpendicular Magnetic Anisotropy

机译:垂直磁各向异性的铁素体薄膜

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Co-ferrite thin film with spinel structure is attractive for spintronics and multifunctional devices. So far, single-crystal substrates are necessary to introduce perpendicular magnetic anisotropy in co-ferrite films. In this paper, a unique process has been developed to deposit co-ferrite thin films onto thermally oxidized silicon wafer with perpendicular magnetic anisotropy. We have successfully prepared co-ferrite films with (00) orientation. Those films show perpendicular coercivities as large as 12.8 kOe. X-ray diffractometry results revealed that compressive strain, which is introduced by the postannealing process rather than deposition process, is as large as 1.3% in films with (00) orientation. The large coercivity and perpendicular magnetic anisotropy can be quantitatively explained by the magnetoelastic effect. This silicon-compatible fabrication process is useful to further extending the applications of co-ferrite films.
机译:具有尖晶石结构的共铁氧体薄膜对于自旋电子学和多功能器件具有吸引力。迄今为止,单晶衬底对于在铁氧体膜中引入垂直磁各向异性是必不可少的。在本文中,已经开发出一种独特的工艺,以垂直磁各向异性将共铁氧体薄膜沉积到热氧化的硅晶片上。我们已经成功地制备了(00)取向的铁氧体薄膜。这些薄膜显示出垂直矫顽力高达12.8 kOe。 X射线衍射结果表明,在(00)取向薄膜中,由后退火工艺而非沉积工艺引入的压缩应变高达1.3%。大的矫顽力和垂直磁各向异性可以通过磁弹效应定量地解释。这种与硅兼容的制造工艺对于进一步扩展钴铁氧体薄膜的应用很有用。

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